SSIC Technical Data( Sefl-sintered silicon carbide):
SIC Purity (%) ≥ 98
Granuliform (um) 0.5 - 0.7
Density (g/cm3)≥ 3.10
Hardness (HRA) ≥ 93
Bending strength (Mpa) 400-500
Compressive strength (Mpa) >2500
Fracture Toughness 3.50-4.60
Modulus of elasticity (GPa) 380-410
Thermal conductivity (Cal/cm. S. 0c) 0.2
Coefficient of thermal expansion (mm/mm0k) 5.20- 4.2
Poisson ratio 0.14
RSIC Technical Data(Reaction Bonded silicon carbide):
SIC Purity (%) ≥ 90
Granuliform (um)8-20
Density (g/cm3)≥ 3.05
Hardness (HRA)>90
Bending strength (Mpa)350-450
Compressive strength (Mpa)> 2500
Modulus of elasticity (GPa)>350
Thermal conductivity (Cal/cm. S. 0c)0.3
Coefficient of thermal expansion (mm/mm0k)4.5
Poisson ratio0.15
SIC+C Technical Data:
SIC Purity (%): SiC Content 60%/; C Content 30%; Si Content 10%
Density (g/cm3)>2.85
Hardness (HRA)>80
Bending strength (Mpa)250~300
Compressive strength (Mpa)>1500
Modulus of elasticity (GPa)250
Coefficient of thermal expansion (mm/mm0k)3.0
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Category:
Silicon Carbide
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silicon carbide sealing rings Description
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